Solving the Challenges of High-Speed/High-Bandwidth
Interconnects for Future System-in-Packages

Kemal Aygün
Intel Corporation,
Chandler (AZ), USA
With the emergence of new applications such as artificial intelligence, future electronic systems need to provide increasingly improved performance. One area where the performance demand has been scaling very aggressively is for interconnecting different components by means of system-in-packages with high-speed/high-bandwidth signaling. To address this demand, future system-in-package architectures and designs require innovations in package technologies, high-speed signaling analysis and validation methods and tools, and standardization. This presentation will review some of the recent developments in electronic packaging from scaling of traditional technologies to new advanced packaging technologies for both on- and off-package interconnects. It will also summarize some of the key challenges and solutions for the corresponding electrical methodologies and metrologies that can be used for design, analysis, and validation of such packages. Finally, some recent advances on standardization of on-package high-speed signaling interconnects will be presented with some thoughts on future scaling.
Kemal Aygün received the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2002. In 2003, he joined the Intel Corporation, Chandler, AZ, USA, where he is currently an Intel Fellow and manages the High Speed I/O (HSIO) team in the Electrical Core Competency group. He has co-authored five book chapters, more than 90 journal and conference publications, and holds 91 U.S. patents. His research interests include novel technologies along with electrical modeling and characterization techniques for microelectronic packaging. Dr. Aygün was the General Chair of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems Conference. He is an IEEE Fellow and has been acting as a Distinguished Lecturer for the IEEE Electronics Packaging Society (EPS); a co-chair of the EPS Technical Committee on Electrical Design, Modeling and Simulation; and an associate editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology.

MagIC – Making Magnetics Disappear onto Silicon
Enabling Power Supply on Chip (PwrSoC)
and Power Supply in Package (PwrSiP)

Cian Ó Mathúna
Tyndall National Institute,
University College Cork,
The trend in power delivery for processors and other complex SOC platforms is moving away from Point of Load (POL) power to integrated voltage regulation (IVR). This is facilitating the concept of granular power whereby large arrays of dc-dc converters are integrated within the processor package thereby enabling dramatic reduction in overall system energy. This paradigm shift has been enabled by the dramatic miniaturisation of magnetic inductors using thin-film magnetic cores on silicon and PCB-embedded structures to replace bulky wire-wound devices. This talk will discuss the commercial emergence of magnetics-on-silicon technology (MagIC) and associated PCB-embedded magnetics technologies which are enabling Power Supply on Chip and Power Supply in Package platforms. This emerging space of vertical power delivery is transforming the industry ecosystem for processor and SOC power management. It is also being enabled by the recent focus on Heterogeneous Integration and Chiplet platforms for 2.5D and 3D packaging as evidenced in the EU Chips Act and the USA Chips Act. The technologies will be introduced along with the performance capabilities and improvements over conventional magnetics and Point of Load power. The discussion will also consider Heterogeneous Integration of these components with processors using 2.5D and packaging and the emerging Micro Transfer Printing.
Cian Ó Mathúna is Head of MicroNano Systems at Ireland’s Tyndall National Institute. His research, over three decades, into the miniaturisation and integration of magnetics onto silicon, has played a key role in disruptive developments in integrated power management for processors in portable electronics and high performance computing. Using semiconductor processing of thin-film magnetics, Ó Mathúna’s team have made bulky power magnetic components disappear onto silicon chips. Referred to as MagIC, Tyndall’s magnetics-on-silicon technology has been licensed to two of the world’s leading consumer electronics companies as well as a leading semiconductor foundry. In 2008, Ó Mathúna founded the International Workshop on Power Supply on Chip (PwrSoC) which has become a highly-influential flagship workshop for IEEE Power Electronics Society and US-based Power Sources Manufacturers Association (PSMA). Through his leadership, and his extensive collaborations with world-leading industry players in Europe, USA and Asia, Ó Mathúna has had a significant influence on the emergence of a global supply-chain for PwrSoC that, in 2021, has seen high-volume production of magnetics-on-silicon in commercial product. Prof. Ó Mathúna is an IEEE Fellow and, in 2021, received the IEEE Power Electronics Society Technical Achievement Award for Integration and Miniaturisation of Switching Power Converters and also received an EARTO (European Association of Research and Technology Organisations) Impact Innovation Award.