Call for Papers


• Full Paper Submission:   December 15th   December 29th, 2023
January 12th, 2024 (Final Deadline)

• Notification of Acceptance:   January 31st   February 5th, 2024
(notifications have been sent through EasyChair to all submitted papers)

• Final Paper Submission:   March 15th, 2024


The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission are available in the Submissions menu.


• Modeling and simulation for SI/PI
• Coupled signal and power integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore).

➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.